Go3D BX 700
Industrial 3D printer with a massive 700×500×500 mm build volume, a fully enclosed chamber, and robust motion for large-scale, functional part manufacturing.
Product Highlights:
- Industrial Build Volume: Massive 700 * 500 * 500 mm print area for full-size prototypes and manufacturing.
- High-Temperature Direct Extruder: Dual Drive Direct Extruder reaches Up to 285 ºC for engineering materials.
- Industrial Stability: Z-axis supported by four independent Ball Screws and Chromium Rods for extreme stability on large prints.
- Fully Enclosed Chamber: Eliminates warping and cracking in ABS, ASA, and Carbon Fibre prints.
- Reliability Features: Power Loss Recovery, Filament Runout/Clogging Detection
Description
Product Description:
The Go3D BX 700 is a powerhouse engineered for large-scale projects, offering the volume and stability needed for prototyping, intricate designs, and manufacturing functional parts. It delivers exceptional detail and accuracy across its massive build plate.
Performance and Precision on a Grand Scale
Equipped with a Dual Drive Direct Extruder, the BX 700 handles flexible and high-strength materials with superior control. The combination of a Up to 285 ºC nozzle and a Silicon Heat Bed up to 120 ºC in a fully enclosed chamber ensures excellent layer adhesion and minimizes thermal deformation, crucial for prints that take days to complete.
Core Technical Specifications:
- Build Volume (X*Y*Z): 700 * 500 * 500 mm
- Print Head: Single Extrusion with Dual Drive Direct Extruder (1.75 mm Filament)
- Max Nozzle Temperature: Up to 285 ºC
- Max Bed Temperature: 120 ºC(Silicon Heat Bed)
- Motion System: X & Y Rail Guides , Z Four Ball Screws & Chromium Rods
- Supported Materials: PLA, ABS, PETG, ASA, TPU, PLA Carbon Fibre, PETG Carbon Fibre
- Reliability: Power Loss Recovery, Filament Runout/Clogging Detection
Core Technical Specifications:
- Build Volume (X*Y*Z): 700 * 500 * 500 mm
- Print Head: Single Extrusion with Dual Drive Direct Extruder (1.75 mm Filament)
- Max Nozzle Temperature: Up to 285 ºC
- Max Bed Temperature: 120 ºC(Silicon Heat Bed)
- Motion System: X & Y Rail Guides , Z Four Ball Screws & Chromium Rods
- Supported Materials: PLA, ABS, PETG, ASA, TPU, PLA Carbon Fibre, PETG Carbon Fibre
- Reliability: Power Loss Recovery, Filament Runout/Clogging Detection
Additional information
| Build Volume (mm) | 700×500×500 |
|---|---|
| Max Nozzle Temp | 285∘C |
| Chamber Type | Fully Enclosed |
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